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0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

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Topmatch Electronics (Suzhou) Co., Limited.

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0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

Name: 035mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
Brand: TOPCBS
Price: 1 USD

Quality 0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices for sale

Brand Name : TOPCBS

Model Number : BIB and test Boards

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20units per package box size 20*15*10cm

Layer count : 8Layer

Raw material : IT180A

Finished Treatment : Immerion Gold + OSP

Pitch Size : 0.35mm

Board thickness : 0.8mm

Line width/space : 75um/100um

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0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to withstand the hot temperatures during tests.

Burn in boards utilize high grade materials. For testing up to 125C a special version of FR4 is used (High Tg FR4). For higher temperatures up to 250C a Polyimide is used; and for very high temperatures up to 300C a High grade polyimide is used.

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Name	0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers	8
Quality Grade	IPC 6012 Class 2,IPC 6012 Class 3
Material	IT180
Thickness	0.8mm
Min Track/Spacing	75um/75um
Min Hole Size	Laser 75um
Solder Mask	Green
Silkscreen	White
Surface Finish	Immersion gold + OSP
Finished Copper	12um
Production time	10-21 working days
Lead time	2-3 days

0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

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0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

0.35mm Pitch Hdi Printed Circuit Boards

0.35mm Hdi Printed Circuit Boards Burn In Testing

0.35mm Semiconductor test board

0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices Images